Achieving Optimal Thermal Performance for the 14900K CPU
Table of Contents
- Introduction
- Thermo testing: Baseline
- Changes to Improve Temperatures
- Cinebench R23: Rigorous Testing
- Current Fan Curve and Configuration
- Test Results and Analysis
- CPU Cores and Temps
- CPU Voltage
- Core Clock Frequencies
- Cooling Capability of Push Pull Configuration
- Thermal Throttling and Headroom
- Comparing Scores to Older Thread Ripper
- Factors Affecting Temperatures
- Choice of Radiator
- Thermal Compound
- Replacing the CPU Holder Mechanism
- Instructions and Tools
- Removing the Bracket
- Cleaning the CPU
- Installing the Replacement Mechanism
- Trying Cryo Sheets as Thermal Solution
- Instructions and Usage
- Comparing Results to Thermal Paste
- Conclusion
Article
👉 Introduction
In this article, we will be discussing the thermal performance of the 14900 K build. Our main goal is to control the heat generated by the CPU and improve its cooling efficiency. We will begin by conducting Thermo testing using the stock thermal paste provided with the cooler. After establishing a baseline, we will make adjustments to optimize the temperatures without undervolting. However, if necessary, we might resort to undervolting. Let's dive right into the process and explore our options for achieving better thermals.
👉 Thermo Testing: Baseline
To accurately assess the thermal performance of the CPU, we will be using the Cinebench R23 benchmark, which applies a rigorous workload. This test will push the CPU harder than any Game or video rendering task. To obtain baseline measurements, we will closely monitor the temperatures of the CPU's P cores and E cores. Currently, with the default fan curve and no modifications, we are observing temperature readings ranging from 28 to 31°Celsius. These temps include the E cores as well.
👉 Changes to Improve Temperatures
Our focus for this testing is primarily on temperature control. While we should also consider other factors such as CPU VC core voltage and clock frequencies, our main concern is to achieve better thermals. We will assess the maximum and average temperatures rather than the minimum readings. This will provide a clear understanding of whether our modifications are effective. Let's proceed to the next step and see if we can improve the temperatures without compromising performance.
👉 Cinebench R23: Rigorous Testing
Let's initiate the Cinebench R23 benchmark for a multi-core, single run test. This will allow us to monitor the temperature fluctuations closely. Since the CPU is running under a custom fan curve utilizing the Leon Lee Lconnect 3 software, our setup includes a dynamic fan configuration rather than a static RPM. The test has been running for approximately four to five minutes, and we are already observing temperatures reaching 70 to 78°C. The Package temperature has peaked at 86°C, with one core hitting 88°C. We will continue monitoring the temperatures and decide whether to stop the test or proceed further.
👉 Current Fan Curve and Configuration
It is important to note that the current fan curve and push-pull fan configuration are crucial elements contributing to our thermal performance. The 14900 K build utilizes a total of 12 fans, with six dedicated to the radiator and an additional three functioning as intake fans at the back. Furthermore, there are two 140mm fans drawing air into the system and one rear exhaust fan. This setup provides a significant amount of airflow, which can help dissipate heat effectively and maintain better CPU temperatures.
👉 Test Results and Analysis
After completing the Cinebench R23 benchmark, let's take a closer look at the test results and analyze the data. Our final score stands at 39,245, which is comparable to previous generation Thread Rippers. Although the temperature improvements were not directly proportional to the score increase, the cooling capability of the new setup is impressive. Even with heavy testing, thermal throttling was not triggered, and there is ample headroom with temperatures still 10°C below the threshold.
👉 Cooling Capability of Push Pull Configuration
The push-pull fan configuration implemented in the build played a significant role in achieving the improved cooling capabilities. With the fans positioned on both sides of the radiator, the airflow is maximized, leading to more efficient heat dissipation. The excess number of fans in the case, including the intake and exhaust fans, further contributes to keeping the temperatures under control. Considering the overall cooling system setup, it is evident that our custom configuration has been successful in maintaining stable temperatures.
👉 Thermal Throttling and Headroom
Thermal throttling occurs when the CPU reaches a critical temperature that can negatively impact performance. Our 14900 K build has an operating range of around 100 to 105°C, with thermal throttling typically occurring at 105°C. With current temperatures peaking at 90°C on one core, we still have a comfortable 10°C headroom. This indicates that the cooling system can handle heavy workloads without compromising CPU performance. The ample headroom ensures more stability and protects against potential thermal throttling issues.
👉 Comparing Scores to Older Thread Ripper
Let's compare the scores obtained from our benchmark with those of the older generation Thread Ripper CPU. While the exact comparison may not be available, it is important to gauge the performance of our build relative to its predecessor. Although there is no significant score improvement, it is worth mentioning that the cooling performance of the 14900 K build surpasses that of the older generation CPU. This indicates that the modifications made to the cooling system have been effective.
👉 Factors Affecting Temperatures
When analyzing the thermal performance, it is crucial to consider the factors influencing temperatures. One such factor is the choice of radiator. The specific radiator model used in the 14900 K build plays a role in heat dissipation efficiency. Additionally, other aspects such as the compatibility between the radiator and the Pump, as well as the overall seating and alignment, contribute to achieving optimal thermal performance. These factors must be taken into account when implementing a cooling solution.
👉 Replacing the CPU Holder Mechanism
To further enhance temperature control, we decided to replace the mechanical part that holds down the CPU. Using a Thermog Grizzly mechanism specifically designed for 13th and 14th gen CPUs, we aimed to achieve a flatter CPU surface without any concavity. This replacement mechanism ensures better contact between the CPU and the cooler over time, which can positively impact thermal performance. By following the instructions provided, we successfully installed the new mechanism and proceeded to monitor the temperatures.
👉 Trying Cryo Sheets as Thermal Solution
Another alternative we explored was the use of cryo sheets by Thermog Grizzly. These sheets eliminate the need for thermal paste and offer a reusable, mess-free solution for thermal management. We carefully measured and cut the sheet to fit the CPU's Dimensions, ensuring it sits evenly without touching any other components. Comparing the results obtained with the cryo sheets to those achieved with thermal paste, we observed similar or slightly better temperatures. This suggests that the cryo sheets can serve as a viable thermal solution.
👉 Conclusion
In conclusion, the 14900 K build has showcased its impressive thermal performance and stability. Through careful testing and modifications, we have managed to achieve better cooling capabilities while maintaining satisfactory CPU scores. The push-pull fan configuration, along with the replacement of the CPU holder mechanism, ensured optimal heat dissipation and improved temperature control. The utilization of cryo sheets also provided an alternative to traditional thermal paste, further enhancing the cooling system's efficiency. With these findings, we can confidently state that the 14900 K build is a reliable and powerful system that can handle demanding tasks without compromising on thermals.
Highlights
- Thermo testing reveals baseline temperatures with the stock thermal paste provided.
- The Cinebench R23 benchmark pushes the CPU to its limits, testing its thermals under a rigorous workload.
- The cooling system's push-pull configuration and custom fan curve contribute to improved temperature control.
- Results indicate impressive cooling capabilities, with temperatures remaining below the thermal throttling threshold.
- Comparisons to previous generation CPUs highlight the improved cooling performance of the 14900 K build.
- Factors such as the choice of radiator and seating alignment affect thermal performance.
- Replacing the CPU holder mechanism results in a flatter CPU surface, enhancing heat dissipation.
- Cryo sheets provide a reusable and efficient alternative to traditional thermal paste.
FAQ
Q: What is the purpose of Thermo testing?
A: Thermo testing is conducted to measure and analyze the temperature performance of a CPU under different conditions. It helps identify any potential issues and allows for modifications to optimize cooling efficiency.
Q: What is thermal throttling?
A: Thermal throttling is a protective mechanism employed by CPUs to prevent overheating. When a CPU reaches a critical temperature, it reduces its clock speed to lower the heat output, which can impact performance.
Q: Does the push-pull fan configuration make a difference in cooling temperatures?
A: Yes, the push-pull fan configuration significantly improves heat dissipation. By increasing the airflow over the cooling components, it helps remove heat more efficiently, leading to lower temperatures.
Q: Can cryo sheets be reused?
A: Yes, cryo sheets are designed to be reusable. They eliminate the need for thermal paste and provide a mess-free alternative for thermal management.
Q: Is it necessary to replace the CPU holder mechanism?
A: Replacing the CPU holder mechanism can help ensure a flatter CPU surface, enhancing heat dissipation and improving thermal performance. However, it may not be necessary in all cases and depends on the specific build and requirements.
Resources:
- Leon Lee Lconnect 3 software: [Insert URL]
- Cinebench R23: [Insert URL]
- Thermog Grizzly: [Insert URL]