Revolutionary AMD 3D Chiplet Technology Unveiled at Computex 2021

Revolutionary AMD 3D Chiplet Technology Unveiled at Computex 2021

Table of Contents:

1. Introduction
2. Advanced Packaging Technology
3. High Bandwidth Memory and Silicon Interposer
4. High-Volume Multi-Chip Module Packaging
5. Introduction of Triplets
6. Collaboration with TSMC on 3D Fabric Technology
7. 3D Chip Stacking Technology
8. 3D Vertical Cache
9. Hybrid Bond Approach with Through Silicon Vias
10. Performance Impact on PC Gaming
11. Conclusion

Introduction

In this article, we will delve into the world of advanced packaging technology and explore the innovations that have been made in recent years. From high bandwidth memory to 3D chip stacking, these advancements have revolutionized the computing industry. We will discuss the benefits of these technologies and their impact on various applications, including PC gaming. So, let's dive in and explore the future of packaging technology.

Advanced Packaging Technology

Over the years, the packaging industry has made significant advancements in terms of innovation and technology. These developments have paved the way for smaller form factors, higher memory bandwidth, and increased performance capabilities. One of the key breakthroughs in packaging technology was the introduction of high bandwidth memory (HBM) and silicon interposer technology in 2015. This innovation led the industry in terms of memory bandwidth in compact form factors.

High Bandwidth Memory and Silicon Interposer

High bandwidth memory (HBM) and silicon interposer are groundbreaking technologies that have pushed the boundaries of memory bandwidth in the computing industry. HBM enables faster data transfer rates between the CPU and GPU by stacking memory dies vertically. This compact design reduces the distance that data needs to travel, resulting in higher performance and energy efficiency.

On the other HAND, silicon interposer technology allows for the integration of multiple chips within a single Package. This enables enhanced power delivery and signaling capabilities, further boosting performance. The combination of HBM and silicon interposer technology has revolutionized the data center and PC markets, setting a new performance trajectory.

High-Volume Multi-Chip Module Packaging

In 2017, a significant milestone was achieved in packaging technology with the introduction of high-volume multi-chip module packaging. This packaging approach involves integrating multiple chips, such as CPUs and GPUs, within a single package. By doing so, manufacturers can achieve higher levels of performance and efficiency.

The high-volume multi-chip module packaging technique offers several advantages. It enables more efficient power delivery, reduces signaling delays, and minimizes the overall footprint of the system. This breakthrough paved the way for more powerful and compact computing devices, catering to the ever-increasing demands of consumers.

Introduction of Triplets

Continuing the journey of innovation, in 2019, the introduction of triplets brought a new level of performance and capabilities to the computing industry. Triplets involve using different process nodes for the CPU cores and the IO within the same package. This integration enables significantly higher performance and efficiency.

By using different process nodes, manufacturers can optimize each component for its specific requirements. This approach ensures that the CPU cores and the IO operate at their maximum potential without any compromises. The introduction of triplets has opened doors to new possibilities in high-performance computing, allowing for more power-packed and versatile systems.

Collaboration with TSMC on 3D Fabric Technology

In recent years, there has been a fruitful collaboration between the tech giant and TSMC (Taiwan Semiconductor Manufacturing Company) on their 3D fabric technology. This collaboration aims to combine chiplet packaging with dye stacking to create a 3D triplet architecture for future high-performance computing products.

The 3D fabric technology brings together the benefits of chiplet packaging and dye stacking. Chiplet packaging allows for the integration of different functional blocks within a single package, while dye stacking enables stacking multiple layers of chips vertically. This 3D triplet architecture promises to deliver unparalleled performance and flexibility in high-performance computing applications.

3D Chip Stacking Technology

Now, let's take a closer look at the 3D chip stacking technology that has been developed as a result of the collaboration between the tech giant and TSMC. The first application of this technology is the creation of a 3D vertical cache, which offers significant performance benefits.

In this prototype, a 64-megabyte seven-nanometer SRAM is stacked directly on top of each core complex. By doing so, the amount of high-speed L3 cache feeding the Zen 3 cores is effectively tripled. The 3D cache is bonded directly to the Zen 3 CCD (CPU Complex Die) using through silicon vias for signal and power transmission.

Through the manufacturing process, the 3D cache die is thinned, and structural silicon is added to create a seamless surface for the combined chip. The finished 3D stacked version of the CPU looks exactly the same as the current Ryzen 5000 processors, offering a compact and integrated solution.

3D Vertical Cache

The 3D vertical cache is a Game-changer in terms of performance and memory bandwidth. By tripling the amount of high-speed L3 cache, the 3D vertical cache provides a significant boost to computing tasks. The direct bonding of the cache to the Zen 3 CCD using through silicon vias enables more than two terabytes per Second of bandwidth.

The 3D vertical cache enhances the overall performance of the processor, leading to faster and more efficient data processing. This technology sets a new benchmark for high-performance computing, enabling users to tackle complex tasks with ease.

Hybrid Bond Approach with Through Silicon Vias

The tech giant's 3D chip stacking technology utilizes a hybrid bond approach with through silicon vias (TSVs). This approach provides over 200 times the interconnect density of 2D triplets and more than 15 times the density compared to other 3D stacking solutions. The use of TSVs allows for efficient and dense integration of intellectual property (IP) within the package.

The data die interface of this technology employs a direct copper-to-copper bond, eliminating the need for solder bumps. This approach significantly improves thermals, transistor density, and interconnect pitch. Moreover, it requires only one-third of the energy per signal compared to micro bump 3D approaches. These advancements make the tech giant's 3D chip stacking technology the most advanced and flexible active-on-active silicon stacking solution in the world.

Performance Impact on PC Gaming

One area where the impact of the tech giant's packaging technology is highly noticeable is PC gaming. PC gaming has always demanded intense memory subsystem performance, and the 3D triplet technology delivers exactly that. The introduction of the 3D V cache technology has shown a significant improvement in gaming performance.

In a demo using the popular game Gears 5, the tech giant compared the gaming performance of the Ryzen 9 5900X, today's fastest gaming CPU, with the 3D triplet prototype based on the 5900X. Both CPUs had the same core count and thread count and were fixed at a 4 gigahertz clock speed.

The results were astounding. The 3D triplet prototype improved gaming performance by an average of 12 percent compared to the Ryzen 9 5900X. This 12 percent improvement is nothing short of phenomenal and showcases the real-world impact of 3D triplets on gaming workloads.

When examining multiple popular game titles, the impact of the V cache technology becomes even more apparent. On average, a 15 percent improvement at 1080p resolution was observed. This level of improvement is equivalent to an entire architectural generation's worth of gaming performance. The 3D V cache technology offers gamers a next-level gaming experience with enhanced speed and responsiveness.

Conclusion

The tech giant's continuous investments in innovation and packaging technology have revolutionized the computing industry. From the introduction of high bandwidth memory and silicon interposer technology to the development of triplets and 3D chip stacking, the company has consistently paved the way for higher performance and efficiency.

The collaboration with TSMC on 3D fabric technology has further pushed the boundaries of chiplet packaging and dye stacking. The resulting 3D triplet architecture promises unparalleled performance and flexibility in high-performance computing applications.

With the introduction of the 3D vertical cache, the tech giant has once again demonstrated its commitment to delivering groundbreaking advancements. The 3D chip stacking technology with its hybrid bond approach and through silicon vias sets new standards in interconnect density, thermals, and energy efficiency.

The impact of these advancements is especially prominent in PC gaming. The 3D triplet technology, with its 3D V cache, offers a significant boost in gaming performance, providing gamers with a faster and more immersive experience.

As we look towards the future, it is evident that the tech giant's continuous pursuit of innovation and advancement in packaging technology will continue to Shape the computing industry. By pushing the boundaries and delivering cutting-edge solutions, they are driving the industry forward, empowering users with enhanced performance and capabilities.

Highlights:

• Introduction to advanced packaging technology
• High bandwidth memory and silicon interposer
• High-volume multi-chip module packaging
• Introduction of triplets for higher performance and capabilities
• Collaboration with TSMC on 3D fabric technology
• 3D chip stacking technology for compact and integrated solutions
• 3D vertical cache for improved performance and memory bandwidth
• Hybrid bond approach with through silicon vias for efficient integration
• Impact of 3D triplet technology on PC gaming
• Continuous innovation and advancements in packaging technology

FAQ:

Q: What is the significance of high bandwidth memory and silicon interposer? A: High bandwidth memory and silicon interposer technology have revolutionized the computing industry by enabling faster data transfer rates, compact designs, and enhanced energy efficiency.

Q: How does the collaboration with TSMC contribute to packaging technology advancements? A: The collaboration with TSMC on 3D fabric technology combines chiplet packaging and dye stacking, resulting in a 3D triplet architecture that offers unparalleled performance and flexibility.

Q: What is the impact of the 3D vertical cache on gaming performance? A: The 3D vertical cache significantly improves gaming performance, with an average improvement of 12 percent compared to traditional CPUs. This technology brings faster data processing and enhanced memory bandwidth to PC gaming.

Q: Will the tech giant continue to innovate in packaging technology? A: Yes, the tech giant has demonstrated its commitment to continuous innovation and advancement in packaging technology. They will undoubtedly continue to push the boundaries and deliver cutting-edge solutions to empower users with enhanced performance and capabilities.

Resources:

• Tech Giant Official Website
• TSMC Official Website